China Advanced Technology Monitoring Act
H.R. 5287, the China Advanced Technology Monitoring Act, would require the Secretary of Defense to deliver an annual, unclassified report (with a classified annex) on China’s advanced semiconductor manufacturing capabilities. Beginning no later than May 1, 2026, and for five consecutive years thereafter, the Secretary would report to Congress (in consultation with other federal agencies) on China’s capabilities in both advanced and mature-node semiconductors. The report would cover a broad range of topics, including China’s domestic manufacturing capacity, its industrial policies, year-by-year technology development (across design, IP, R&D, materials, equipment, software, and packaging), and China’s international engagement and collaborations related to semiconductor manufacturing. It would also scrutinize the effectiveness of U.S. export controls, potential loopholes or circumventions, and recommendations to strengthen controls. The unclassified portion would be publicly posted online, with a classified annex for additional intelligence. The bill aims to inform Congress about China’s progress and to shape U.S. policy and protections against rising China-led semiconductor capabilities. By detailing how China’s policies and international activities affect U.S. competitiveness and national security, the report could influence future policy decisions, export-control measures, and strategic planning across the defense and technology sectors.
Key Points
- 1Annual reporting requirement and timeline
- 2- Requires a yearly report on China’s semiconductor capabilities (advanced and mature nodes), starting by May 1, 2026, for five years, submitted by the Secretary of Defense in consultation with other federal agencies.
- 3BroadScope of topics
- 4- The report must cover key findings, China’s domestic capabilities, China’s industrial policies and their outcomes, and a year-by-year analysis of China’s tech development in semiconductors and AI chipmaking, including all elements of the manufacturing ecosystem (design, IP, R&D, materials, equipment, tools, software, and advanced packaging).
- 5Export controls assessment
- 6- Analyzes how U.S. export controls affect China’s progress, including potential workarounds, circumvention via investments or third-party acquisitions, and risks from collaborations and supplier movements; includes recommendations to strengthen controls.
- 7Engagement and collaboration analysis
- 8- Examines China’s engagement with other countries and markets on semiconductor equipment capabilities, including foreign investments, trade, partnerships, and joint ventures.
- 9Public transparency and classified detail
- 10- The report will be unclassified with a classified annex; the unclassified portion (or synopsis) will be posted publicly on a federal website, with a Federal Register notice announcing publication.